page17
Composition
Melting point (°C)
Toxic
Eutectic
Comments
Solidus
Liquidus
Sn
90
Pb
10
183
213
[6]
Pb
No
formerly used for joints in food industry
Sn
95
Pb
5
238
Pb
No
plumbing and heating
Pb
92
Sn
5.5
Ag
2.5
286
301
[18]
Pb
No
For higher-temperature applications.
Pb
80
Sn
12
Sb
8
Pb
No
Used for soldering iron and steel
[13]
Pb
80
Sn
18
Ag
2
252
260
[6]
Pb
No
Used for soldering iron and steel
[13]
Pb
79
Sn
20
Sb
1
184
270
Pb
No
Sb1
Pb
55
Sn
43.5
Sb
1.5
Pb
No
General purpose solder. Antimony content improves mechanical properties but causes brittleness when soldering cadmium, zinc, or galvanized metals.
[13]
Sn
43
Pb
43
Bi
14
144
163
[5]
Pb
No
Bi14. Good fatigue resistance combined with low melting point. Contains phases of tin and lead-bismuth.
[21]
Useful for step soldering.
Sn
46
Pb
46
Bi
8
120
167
[6]
Pb
No
Bi8
Bi
52
Pb
32
Sn
16
96
Pb
yes?
Bi52. Good fatigue resistance combined with low melting point. Reasonable shear strength and fatigue properties. Combination with lead-tin solder may dramatically lower melting
point and lead to joint failure.
[21]
Bi
46
Sn
34
Pb
20
100
105
[6]
Pb
No
Bi46
Sn
62
Pb
36
Ag
2
179
[5]
Pb
Yes
Sn62. Common in electronics. The strongest tin-lead solder. Appearance identical to Sn60Pb40 or Sn63Pb37. Crystals of Ag
3
Sn may be seen growing from the solder. Extended heat
treatment leads to formation of crystals of binary alloys. Silver content decreases solubility of silver, making the alloy suitable for soldering silver-metallized surfaces, e.g. SMD
capacitors and other silver-metallized ceramics.
[15][17][21]
Not recommended for gold.
[8]
General-purpose.
Sn
62.5
Pb
36
Ag
2.5
179
[5]
Pb
Yes
Pb
88
Sn
10
Ag
2
268
267
290
[5]
299
[22]
Pb
No
Sn10, Pb88. Silver content reduces solubility of silver coatings in the solder. Not recommended for gold.
[8]
Forms a eutectic phase, not recommended for operation above 120 °C.
Pb
90
Sn
5
Ag
5
292
[5]
Pb
Yes
Pb
92.5
Sn
5
Ag
2.5
287
299
296
[5]
304
[6]
Pb
No
Pb93.
Pb
93.5
Sn
5
Ag
1.5
296
305
301
[5]
306
[6]
Pb
No
Pb94, HMP alloy, HMP. Service temperatures up to 255 °C. Useful for step soldering. Also can be used for extremely low temperatures as it remains ductile down to −200 °C, while
solders with more than 20% tin become brittle below −70 °C. Higher strength and better wetting than Pb
95
Sn
5
.
[17]
Pb
95.5
Sn
2
Ag
2.5
299
304
[5]
Pb
No
In
97
Ag
3
143
[23]
No
Yes
Wettability and low-temperature malleability of indium, strength improved by addition of silver. Particularly good for cryogenic applications. Used for packaging of photonic devices.
In
90
Ag
10
143
237
[24]
No
No
Nearly as wettable and low-temperature malleable as indium. Large plastic range. Can solder silver, fired glass and ceramics.
In
75
Pb
25
156
165
[8]
Pb
No
Less gold dissolution and more ductile than lead-tin alloys. Used for die attachment, general circuit assembly and packaging closures.
[8]
In
70
Pb
30
160
165
174
[5]
175
[6][25]
Pb
No
In70. Suitable for gold, low gold-leaching. Good thermal fatigue properties.
In
60
Pb
40
174
173
185
[5]
181
[6]
Pb
No
In60. Low gold-leaching. Good thermal fatigue properties.
In
50
Pb
50
180
178
209
[8]
210
[6]
Pb
No
In50. Only one phase. Resoldering with lead-tin solder forms indium-tin and indium-lead phases and leads to formation of cracks between the phases, joint weakening and failure.
[21]
On gold surfaces gold-indium intermetallics tend to be formed, and the joint then fails in the gold-depleted zone and the gold-rich intermetallic.
[26]
Less gold dissolution and more
ductile than lead-tin alloys.
[8]
Good thermal fatigue properties.
In
50
Sn
50
118
125
[27]
No
No
Cerroseal 35. Fairly well wets glass, quartz and many ceramics. Malleable, can compensate some thermal expansion differences. Low vapor pressure. Used in low temperature
physics as a glass-wetting solder.
[28]
In
70
Sn
15
Pb
9.6
Cd
5.4
125
[29]
Cd, Pb
Pb
75
In
25
250
240
264
[8]
260
[30]
Pb
No
In25. Low gold-leaching. Good thermal fatigue properties. Used for die attachment of e.g. GaAs dies.
[26]
Used also for general circuit assembly and packaging closures. Less
dissolution of gold and more ductile than tin-lead alloy.
[8]
Sn
70
Pb
18
In
12
162
[5]
Pb
Yes
General purpose. Good physical properties.
154
167
[31]
Sn
37.5
Pb
37.5
In
25
134
181
[8]
Pb
No
Good wettability. Not recommended for gold.
[8]
Pb
90
In
5
Ag
5
290
310
[5]
Pb
No