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Composition
Melting point (°C)
Toxic
Eutectic
Comments
Solidus
Liquidus
Bi
44.7
Pb
22.6
In
19.1
Cd
5.3
Sn
8.3
47
Cd, Pb
Yes
Cerrolow 117. Used as a solder in low-temperature physics.
[28]
In
60
Sn
40
113
122
[5]
No
No
In
51.0
Bi
32.5
Sn
16.5
60.5
No
Yes
Field's metal
Bi
49.5
Pb
27.3
Sn
13.1
Cd
10.1
70.9
Cd, Pb
Yes
Lipowitz Metal
Bi
50.0
Pb
25.0
Sn
12.5
Cd
12.5
71
Cd, Pb
Yes
Wood's metal, mostly used for casting.
Bi
50.0
Pb
31.2
Sn
18.8
97
Pb
No
Newton's metal
Bi
50
Pb
28
Sn
22
109
Pb
No
Rose's metal. It was used to secure cast iron railings and balusters in pockets in stone bases and steps. Does not contract on cooling.
Bi
56
Sn
30
In
14
79
91
No
ChipQuik desoldering alloy, lead-free
[82]
Cd
95
Ag
5
338
393
[83]
Cd
No
KappTec General purpose solder that will join all solderable metals except Aluminum. High temperature, high strength solder. It is used in applications where alloys melting higher
than soft solders are required, but the cost and strength of Silver-brazing alloys is not necessary.
[83]
Cd
82.5
Zn
17.5
265
[84]
Cd
Yes
Medium temperature alloy that provide strong, corrosion-resistant joints on most metals.
[84]
Also for soldering aluminium and die-cast zinc alloys.
[13]
Used in cryogenic physics for
attaching electrical potential leads to specimens of metals, as this alloy does not become superconductive at liquid helium temperatures.
[28]
Cd
70
Zn
30
265
300
[84]
Cd
No
Medium temperature alloy that provide strong, corrosion-resistant joints on most metals. Works especially well on Aluminum-to-Aluminum and Aluminum-to-Copper joints, with
excellent corrosion resistance and superior strength in high vibration and high stress applications in electronics, lighting and electrical products.
[84]
Cd
60
Zn
40
265
316
[84]
Cd
No
Medium temperature alloy that provide strong, corrosion-resistant joints on most metals. Works especially well on Aluminum-to-Aluminum and Aluminum-to-Copper joints, with
excellent corrosion resistance and superior strength in high vibration and high stress applications in electronics, lighting and electrical products.
[84]
Cd
78
Zn
17
Ag
5
249
316
[85]
Cd
No
KappTecZ High temperature, high strength solder that may be used on most metals, but works extremely well on Aluminum, Copper and Stainless Steel. It has a high tolerance to
vibration and stress, and good elongation for use on dissimilar metals. Above its liquidus of 600 °F, this solder is extremely fluid and will penetrate the closest joints.
[85]
Sn
40
Zn
27
Cd
33
176
260
[86]
Cd
No
KappRad
[86]
Developed specifically to join and repair Aluminum and Aluminum/Copper radiators and heat exchangers. A lower melting point makes delicate repair work easier.
[86]
Zn
90
Cd
10
265
399
Cd
For soldering aluminium. Good wetting.
[53]
Zn
60
Cd
40
265
335
Cd
For soldering aluminium. Very good wetting.
[53]
Cd
70
Sn
30
140
160
[6]
Cd
No
Cd70, thermal-free solder. Produces low thermal EMF joints in copper, does not form parasitic thermocouples. Used in low-temperature physics.
[28]
Sn
50
Pb
32
Cd
18
145
[6]
Cd, Pb
Cd18
Sn
40
Pb
42
Cd
18
145
[87]
Cd, Pb
Low melting temperature allows repairing pewter and zinc objects, including die-cast toys.
Zn
70
Sn
30
199
376
No
No
For soldering aluminium. Excellent wetting.
[34]
Good strength.
Zn
60
Sn
40
199
341
No
No
For soldering aluminium. Good wetting.
[53]
Zn
95
Sn
5
382
No
yes?
For soldering aluminium. Excellent wetting.
[34]
Sn
90
Au
10
217
[88]
No
Yes
Au
80
Sn
20
280
No
Yes
Au80. Good wetting, high strength, low creep, high corrosion resistance, high thermal conductivity, high surface tension, zero wetting angle. Suitable for step soldering. The original
flux-less alloy, does not need flux. Used for die attachment and attachment of metal lids to semiconductor packages, e.g. kovar lids to ceramic chip carriers. Coefficient of expansion
matching many common materials. Due to zero wetting angle requires pressure to form a void-free joint. Alloy of choice for joining gold-plated and gold-alloy plated surfaces. As some
gold dissolves from the surfaces during soldering and moves the composition to non-eutectic state (1% increase of Au content can increase melting point by 30 °C), subsequent
desoldering requires higher temperature.
[89]
Forms a mixture of two brittle intermetallic phases, AuSn and Au
5
Sn.
[90]
Brittle. Proper wetting achieved usually by using nickel surfaces
with gold layer on top on both sides of the joint. Comprehensively tested through military standard environmental conditioning. Good long-term electrical performance, history of
reliability.
[26]
One of the best materials for soldering in optoelectronic devices and components packaging.
[91]
Low vapor pressure, suitable for vacuum work. Generally used in
applications that require a melting temperature over 150 °C.
[92]
Good ductility. Also classified as a braze.
Au
98
Si
2
370
800
[6]
No
Au98. A non-eutectic alloy used for die attachment of silicon dies. Ultrasonic assistance is needed to scrub the chip surface so a eutectic (3.1% Si) is reached at reflow.
Au
96.8
Si
3.2
370
[6]
363
[93]
No
Yes
Au97.
[89]
AuSi
3.2
is a eutectic with melting point of 363 °C. AuSi forms a meniscus at the edge of the chip, unlike AuSn, as AuSi reacts with the chip surface. Forms a composite
material structure of submicron silicon plates in soft gold matrix. Tough, slow crack propagation.
[46]
Au
87.5
Ge
12.5
361
356
[6]
No
Yes
Au88. Used for die attachment of some chips.
[5]
The high temperature may be detrimental to the chips and limits reworkability.
[26]
Au
82
In
18
451
485
[6]
No
No
Au82. High-temperature, extremely hard, very stiff.