page20
Composition
Melting point (°C)
Toxic
Eutectic
Comments
Solidus
Liquidus
Sn
95
Sb
5
235
232
240
[5][6]
No
No
Sb5, ASTM95TA. The US plumbing industry standard. It displays good resistance to thermal fatigue and good shear strength. Forms coarse dendrites of tin-rich solid solution with
SbSn intermetallic dispersed between. Very high room-temperature ductility. Creeps via viscous glide of dislocations by pipe diffusion. More creep-resistant than SnAg
3.5
. Antimony
can be toxic. Used for sealing chip packagings, attaching I/O pins to ceramic substrates, and die attachment; a possible lower-temperature replacement of AuSn.
[42]
High strength and
bright finish. Use in air conditioning, refrigeration, some food containers, and high-temperature applications.
[12]
Good wettability, good long-term shear strength at 100 °C. Suitable for
potable water systems. Used for stained glass, plumbing, and radiator repairs.
Sn
97
Sb
3
232
238
[64]
No
No
Sn
99
Sb
1
232
235
[65]
No
No
Sn
99
Ag
0.3
Cu
0.7
No
Sn
96.2
Ag
2.5
Cu
0.8
Sb
0.5
217
[6]
225
No
Ag03A. Patented by AIM alliance.
Sn
88
In
8.0
Ag
3.5
Bi
0.5
197
208
No
Patented by Matsushita/Panasonic.
Bi
57
Sn
42
Ag
1
137
139
139
140
[66]
No
Addition of silver improves mechanical strength. Established history of use. Good thermal fatigue performance. Patented by Motorola.
Bi
58
Sn
42
138
[5][8]
No
Yes
Bi58. Reasonable shear strength and fatigue properties. Combination with lead-tin solder may dramatically lower melting point and lead to joint failure.
[21]
Low-temperature eutectic
solder with high strength.
[8]
Particularly strong, very brittle.
[5]
Used extensively in through-hole technology assemblies in IBM mainframe computers where low soldering temperature
was required. Can be used as a coating of copper particles to facilitate their bonding under pressure/heat and creating a conductive metallurgical joint.
[59]
Sensitive to shear rate.
Good for electronics. Used in thermoelectric applications. Good thermal fatigue performance.
[67]
Established history of use. Expands slightly on casting, then undergoes very low
further shrinkage or expansion, unlike many other low-temperature alloys which continue changing dimensions for some hours after solidification.
[28]
Bi
58
Pb
42
124
126
[68]
Pb
In
80
Pb
15
Ag
5
142
149
149
[6]
154
[69]
Pb
No
In80. Compatible with gold, minimum gold-leaching. Resistant to thermal fatigue. Can be used in step soldering.
Pb
60
In
40
195
225
[6]
Pb
No
In40. Low gold-leaching. Good thermal fatigue properties.
Pb
70
In
30
245
260
[6]
Pb
No
In30
Sn
37.5
Pb
37.5
In
26
134
181
[6]
Pb
No
In26
Sn
54
Pb
26
In
20
130
140
154
[6]
152
[70]
Pb
No
In20
Pb
81
In
19
270
260
280
[6]
275
[71]
Pb
No
In19. Low gold-leaching. Good thermal fatigue properties.
In
52
Sn
48
118
No
Yes
In52. Suitable for the cases where low-temperature soldering is needed. Can be used for glass sealing.
[59]
Sharp melting point. Good wettability of glass, quartz, and many ceramics.
Good low-temperature malleability, can compensate for different thermal expansion coefficients of joined materials.
Sn
52
In
48
118
131
[5]
No
No
very low tensile strength
Sn
58
In
42
118
145
[72]
No
No
Sn
51.2
Pb
30.6
Cd
18.2
145
[73]
Cd, Pb
Yes
General-purpose. Maintains creep strength well. Unsuitable for gold.
Sn
77.2
In
20
Ag
2.8
175
187
[74]
No
No
Similar mechanical properties with Sn
63
Pb
37
, Sn
62
Pb
36
Ag
2
and Sn
60
Pb
40
, suitable lead-free replacement. Contains eutectic Sn-In phase with melting point at 118 °C, avoid use
above 100 °C.
In
74
Cd
26
123
[75]
Cd
Yes
In
66.7
Bi
33.3
72.7
In
61.7
Bi
30.8
Cd
7.5
62
[76]
Cd
Yes
Bi
47.5
Pb
25.4
Sn
12.6
Cd
9.5
In
5
57
65
[77]
Cd, Pb
No
Bi
48
Pb
25.4
Sn
12.8
Cd
9.6
In
4
61
65
[78]
Cd, Pb
No
Bi
49
Pb
18
Sn
15
In
18
58
69
[79]
Pb
No
Bi
49
Pb
18
Sn
12
In
21
58
Pb
Yes
Cerrolow 136. Slightly expands on cooling, later shows slight shrinkage in couple hours afterwards. Used as a solder in low-temperature physics.
[28]
Also the ChipQuik desoldering
alloy.
[80]
Bi
50.5
Pb
27.8
Sn
12.4
Cd
9.3
70
73
[81]
Cd, Pb
No
Bi
50
Pb
26.7
Sn
13.3
Cd
10
70
Cd, Pb
Yes
Cerrobend. Used in low-temperature physics as a solder.
[28]