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Composition
Melting point (°C)
Toxic
Eutectic
Comments
Solidus
Liquidus
In
100
157
No
Pure
In99. Used for die attachment of some chips. More suitable for soldering gold, dissolution rate of gold is 17 times slower than in tin-based solders and up to 20% of gold can be
tolerated without significant embrittlement. Good performance at cryogenic temperatures.
[94]
Wets many surfaces incl. quartz, glass, and many ceramics. Deforms indefinitely under
load. Does not become brittle even at low temperatures. Used as a solder in low-temperature physics, will bond to aluminium. Can be used for soldering to thin metal films or glass
with an ultrasonic soldering iron.
[28]
Sn
90.7
Ag
3.6
Cu
0.7
Cr
5
217
1050
[95]
No
No
C-Solder. Lead-free, low-temperature soldering alloy for joining of various carbon materials including carbon fibres and carbon nanotube fibres in both carbon-carbon and carbon-
metal arrangements. Produces mechanically strong and electrically conductive bonds. Provides wetting of carbon
[96]
and other materials generally considered as difficult to solder,
including aluminium, stainless steel, titanium, glass, and ceramics.
In the Sn-Pb alloys, tensile strength increases with increasing tin content. Indium-tin alloys with high indium content have very low tensile strength.
[5]
For soldering semiconductor materials, e.g. die attachment of silicon, germanium and gallium arsenide, it is important that the solder contains no impurities that could cause doping in the wrong direction. For soldering n-
type semiconductors, solder may be doped with antimony; indium may be added for soldering p-type semiconductors. Pure tin can also be used.
[34][97]
Various fusible alloys can be used as solders with very low melting points; examples include Field's metal, Lipowitz's alloy, Wood's metal, and Rose's metal.
The thermal conductivity of common solders ranges from 30 to 400 W/(m·K), and the density from 9.25 to 15.00 g/cm
3
.
[98][99]
Material
Thermal conductivity
[99]
(W/m·K)
Melting point
[99]
(°C)
Sn-37Pb (eutectic)
50.9
183
Sn-0.7Cu
53
[1]
227
Sn-2.8Ag-20.0In
53.5
175–186
Sn-2.5Ag-0.8Cu-0.5Sb
57.26
215–217
Pb-5Sn
63
310
Lead (Pb)
35.0
327.3
Tin (Sn)
73.0
231.9
Aluminum (Al)
240
660.1
Copper (Cu)
393–401
1083
FR-4
1.7
Phase diagrams of different types of solder alloys (http://www.metallurgy.nist.gov/phase/solder/solder.html)
Retrieved from "https://en.wikipedia.org/w/index.php?title=Solder_alloys&oldid=1019147477"
Notes on the above table
Properties